LOCTITE LF 318 97SCAGS88.5V BK - 500g (pasta lutownicza)
Nr
IDH.698838
LOCTITE LF 318 97SCAGS88.5V BK - 500g (pasta lutownicza)
Product description:
LOCTITE LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has a high tack force to resist component movement during high speed placement and long printer abandon times. LOCTITE LF 318 shows excellent solderability over a wide range of reflow profiles in both air and nitrogen across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper. Further information about the product: biuro@woronko-kleje.pl
Features and benefits:
● Good humidity resistance. Gives excellent coalescence even after 72 hours exposure to 27ºC/80% RH, reducing process variation due to environmental factors.
● Clear residues for easy post-reflow inspection.
● Soft, non-stick, pin testable residues allow easy in-circuit testing.
● Suitable for fine pitch, high speed printing up to 150mm/s (6"/s).
● Extended open time and tack-life leading to low wastage.
● Halide-free flux classification: ROL0 to ANSI/J-STD-004.
Directions for use:
Printing:
1. LOCTITE LF 318 is available for stencil printing down to 0.4mm (0.016") pitch devices, with type Type 3 (AGS) powder.
2. Printing at speeds between 25mm/s (1.0"/s) and 150mm/s (6"/s) can be achieved by using laser cut and electro-polished, electroformed stencils, metal squeegees (preferably 60°).
3. Acceptable first prints have been achieved at 0.4mm (0.016") pitch after printer down times of 240 minutes without requiring a knead cycle.
Reflow:
● Any of the available methods of heating to cause reflow may be used including IR, convection, hot belt, vapor phase and laser soldering.
● LOCTITE LF 318 is not sensitive to reflow profile type.
● No single reflow profile is deemed suitable for all processes and applications, but the following example profiles have given good results in practice.
Cleaning:
1. LOCTITE LF 318 solder pastes are no-clean and are designed to be left on the PCB in many applications post-assembly since they do not pose a hazard to long-term reliability.
2. Residue removal can be achieved using conventional cleaning processes based on solvents such as LOCTITE MCF 800 or suitable saponifying agents.
3. For stencil cleaning and cleaning board misprints, LOCTITE MSC 01 solvent cleaner is recommended.
Storage:
It is recommended to store LOCTITE LF 318 at 0 to 10°C. (NB cartridges should be stored tip down to prevent the formation of air pockets). The paste should be removed from cold storage a minimum of 8 hours before use. Do not use forced heating methods to bring solder paste up to temperature. LOCTITE LF 318 has been formulated to minimize flux seperation on storage but should this occur, gentle stirring for 15 seconds will return the product to it's correct rheological performance. To prevent contamination of unused product, do not return any material to its original container. For further specific shelf life information, contact your local Technical Service Center.
Parameters:
Typical properties (Based on Type 3 powder): Alloys : 96SC, 97SC, Powder Particle Size, µm : 25-45 Powder Size Coding : AGS Metal Loading (Weight %) : 88.5 Brookfield Viscosity TF spindle, 25°C, 5rpm after 2 minutes, mPa∙s : 765,000 Thixotropic Index (Ti), 25°C (Ti = log(viscosity @ 1.8s-1 / viscosity @ 18s-1 ) : 0.54 Malcom Rheology, 10rpm, 25°C, Rate 6s-1 : 1,961 Initial tack force,g mm-² : 2.0 Useful open time, hours : >24
Full information can be found on the technical sheet of the product.
LOCTITE LF 318 solder paste is a halide-free, no clean, pin testable Pb-free solder paste, formulated to have excellent humidity resistance and a broad process window, both for reflow and printing. This product has a high tack force to resist component movement during high speed placement and long printer abandon times. LOCTITE LF 318 shows excellent solderability over a wide range of reflow profiles in both air and nitrogen across a wide range of surface finishes including Ni/Au, Immersion Sn, Immersion Ag and OSP copper. Further information about the product: biuro@woronko-kleje.pl
Features and benefits:
● Good humidity resistance. Gives excellent coalescence even after 72 hours exposure to 27ºC/80% RH, reducing process variation due to environmental factors.
● Clear residues for easy post-reflow inspection.
● Soft, non-stick, pin testable residues allow easy in-circuit testing.
● Suitable for fine pitch, high speed printing up to 150mm/s (6"/s).
● Extended open time and tack-life leading to low wastage.
● Halide-free flux classification: ROL0 to ANSI/J-STD-004.
Directions for use:
Printing:
1. LOCTITE LF 318 is available for stencil printing down to 0.4mm (0.016") pitch devices, with type Type 3 (AGS) powder.
2. Printing at speeds between 25mm/s (1.0"/s) and 150mm/s (6"/s) can be achieved by using laser cut and electro-polished, electroformed stencils, metal squeegees (preferably 60°).
3. Acceptable first prints have been achieved at 0.4mm (0.016") pitch after printer down times of 240 minutes without requiring a knead cycle.
Reflow:
● Any of the available methods of heating to cause reflow may be used including IR, convection, hot belt, vapor phase and laser soldering.
● LOCTITE LF 318 is not sensitive to reflow profile type.
● No single reflow profile is deemed suitable for all processes and applications, but the following example profiles have given good results in practice.
Cleaning:
1. LOCTITE LF 318 solder pastes are no-clean and are designed to be left on the PCB in many applications post-assembly since they do not pose a hazard to long-term reliability.
2. Residue removal can be achieved using conventional cleaning processes based on solvents such as LOCTITE MCF 800 or suitable saponifying agents.
3. For stencil cleaning and cleaning board misprints, LOCTITE MSC 01 solvent cleaner is recommended.
Storage:
It is recommended to store LOCTITE LF 318 at 0 to 10°C. (NB cartridges should be stored tip down to prevent the formation of air pockets). The paste should be removed from cold storage a minimum of 8 hours before use. Do not use forced heating methods to bring solder paste up to temperature. LOCTITE LF 318 has been formulated to minimize flux seperation on storage but should this occur, gentle stirring for 15 seconds will return the product to it's correct rheological performance. To prevent contamination of unused product, do not return any material to its original container. For further specific shelf life information, contact your local Technical Service Center.
Parameters:
Typical properties (Based on Type 3 powder):
Full information can be found on the technical sheet of the product.
