LOCTITE C 502 99C 5C 0.7MM H - 0,5kg (Drut lutowniczy 99C (Sn 99.3, Cu 0.7))
Nr
IDH.583951
LOCTITE C 502 99C 5C 0.7MM H - 0,5kg (Drut lutowniczy 99C (Sn 99.3, Cu 0.7))
Product description:
LOCTITE C 502 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. LOCTITE C 502 is also well suited for soldering applications requiring high melting temperature alloys.
ALLOYS:
The alloys used in LOCTITE C 502 cored solder wires conform to the purity requirements of the common national and international standards.
FLUX:
LOCTITE C 502 solid flux is based on modified rosin and carefully selected activators. In practice they exhibit a mild rosin odor and leave a small quantity of clear residue.
Further information about the product: biuro@woronko-kleje.pl
Directions for use:
Soldering with LOCTITE C 502 does not require any special methods or deviation from standard hand soldering practices.
Soldering Process:
1. Apply the soldering iron tip to the work surface. The iron tip should contact both the base material and the lead at the same time to heat both surfaces properly. It should take no more than a fraction of a second to heat both surfaces adequately.
2. Apply LOCTITE C 502 flux cored wire to a part of the joint surface away from the soldering iron and allow to form a joint fillet. This will be virtually instantaneous. Do not apply excessive solder to the joint as this will not improve joint integrity and it will leave excess flux residues on the surface.
3. Remove solder from the work piece and then remove the iron tip.
4. The total process will be very rapid, depending upon thermal mass, tip temperature, tip configuration and the solderability of the surfaces to be joined.
5. The resin and flux systems are designed to leave relatively low residues and to minimize residual activity. This is achieved by ensuring some decomposition and volatilization takes place during the soldering process.
Cleaning:
LOCTITE C 502 flux cored solder wire has been formulated to leave amber flux residues and resist spitting and fuming. Inmost industrial and consumer electronics applications, cleaning will not be required. The product may, therefore, be used to complement a no-clean wave soldering or reflow process or to allow repairs to cleaned boards without the need for a second cleaning process. In high-reliability applications, the residues should be removed. Should cleaning be required, this is best achieved using SC-01 cleaner.
Parameters:
J-STD-004 Solder spread, mm²: 310 Corrosion Test Pass SIR (without cleaning) IPC-SF-818 Class : 3 Pass Bellcore TR-NWT-000078: Pass Electromigration (without cleaning) Bellcore TR-NWT-000078: Pass
Full technical information can be found in the technical data sheet.
LOCTITE C 502 cored solder wire has been specially formulated to complement no clean wave and reflow soldering processes. LOCTITE C 502 is also well suited for soldering applications requiring high melting temperature alloys.
ALLOYS:
The alloys used in LOCTITE C 502 cored solder wires conform to the purity requirements of the common national and international standards.
FLUX:
LOCTITE C 502 solid flux is based on modified rosin and carefully selected activators. In practice they exhibit a mild rosin odor and leave a small quantity of clear residue.
Further information about the product: biuro@woronko-kleje.pl
Directions for use:
Soldering with LOCTITE C 502 does not require any special methods or deviation from standard hand soldering practices.
Soldering Process:
1. Apply the soldering iron tip to the work surface. The iron tip should contact both the base material and the lead at the same time to heat both surfaces properly. It should take no more than a fraction of a second to heat both surfaces adequately.
2. Apply LOCTITE C 502 flux cored wire to a part of the joint surface away from the soldering iron and allow to form a joint fillet. This will be virtually instantaneous. Do not apply excessive solder to the joint as this will not improve joint integrity and it will leave excess flux residues on the surface.
3. Remove solder from the work piece and then remove the iron tip.
4. The total process will be very rapid, depending upon thermal mass, tip temperature, tip configuration and the solderability of the surfaces to be joined.
5. The resin and flux systems are designed to leave relatively low residues and to minimize residual activity. This is achieved by ensuring some decomposition and volatilization takes place during the soldering process.
Cleaning:
LOCTITE C 502 flux cored solder wire has been formulated to leave amber flux residues and resist spitting and fuming. Inmost industrial and consumer electronics applications, cleaning will not be required. The product may, therefore, be used to complement a no-clean wave soldering or reflow process or to allow repairs to cleaned boards without the need for a second cleaning process. In high-reliability applications, the residues should be removed. Should cleaning be required, this is best achieved using SC-01 cleaner.
Parameters:
Full technical information can be found in the technical data sheet.
